Analysis of smart laminated composites integrated with piezoelectric patches using spectral element method and lamination parameters

Abstract

This paper investigates the effect of stacking sequence on the power output of a smart composite panel integrated with piezoelectric patches, using lamination parameter formulation and spectral element method (SEM). The deformation of the panel is expressed using the first-order shear deformation theory. The strain energy of the host plate is formulated using lamination parameters and the governing equations are derived following Hamilton's principle. To solve the governing equations accurately and efficiently, a spectral element method is applied where the structure is divided into regions that are continuous in terms of geometry, and element matrices of each region are calculated using the spectral Chebyshev approach. This method benefits both from the (geometry) flexibility of the finite element method and the accuracy of the meshless methods. The developed electromechanical model is used to study the effect of the number of piezo patches and their sizes. To demonstrate the accuracy and performance of the presented SEM, six case studies were investigated by comparing natural frequencies, structural/voltage frequency response functions (FRFs), and computational duration to those obtained from a finite element analysis (FEA). The maximum difference in the predicted natural frequencies between the SEM and FEA results is below 1% and the FRFs obtained using the presented solution technique excellently match the FEA results. Yet, the simulation duration is significantly reduced compared to FEA. To exploit the computational efficiency of the presented analysis approach, optimization case studies were also performed implementing a genetic algorithm to maximize the power output by optimizing the stacking sequence and patch distribution.